| PART |
Description |
Maker |
| M6MGT647M34CKT M6MGB647M34CKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| S72WS256NDEBAW4Y3 S72WS256NFGBAW4Y3 S72WS512ND0BFW |
Based MCP/PoP Products
|
http://
|
| S72WS512PE0HF01G0 S72WS512PE0HF0GH2 S72WS256PD0HF0 |
based MCP/PoP Products
|
SPANSION[SPANSION]
|
| S75WS256PEFKFF S75WS-P S71WS512PD0HFFLW3 S71WS256P |
based MCP/POP Products
|
SPANSION[SPANSION]
|
| S71WS256PD0KFFLW0 S71WS256PD0HFFLW2 S71WS256PD0KFF |
based MCP/POP Products 基于MCP持久性有机污染物产品
|
Spansion, Inc.
|
| S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| 2-1418883-1 |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
Tyco Electronics
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAMA82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位4Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
|
AMIC Technology, Corp.
AMIC Technology Corporation
|
| S71GL032A40BFI0B2 S71GL064A80BAI0B3 S71GL064A80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM SPECIALTY MEMORY CIRCUIT, PBGA56
DIODE ZENER 200MW 5.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56
DIODE ZENER 200MW 9.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) Flash Memory and RAM 堆叠式多芯片产品（MCP）的闪存和RAM
DIODE ZENER 200MW 4.7V 1005
INDUCTOR POWER 3.3UH 5.4A SMD
INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM,
|
Spansion, Inc.
Spansion Inc.
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
